ArF Excimer Laser Annealing of Polycrystalline Silicon Thin Film

Crystallization of amorphous silicon (a-Si) using excimer laser annealing (ELA) has been reported since 1994 by Watanabe group. It is known as the best method to fabricate a good poly-silicon because it can heat the film up to the melting point and, at the same time no thermal damage occur into the glass substrate (Carluccio et al., 1997; Matsumura and Oh, 1999). ELA technique is widely used to increase the grain size and changes the microstructure of polysilicon thin film which is the most important characteristics of excellent built-in polysilicon devices (Palani et al., (2008). The principle advantage of excimer lasers is the strong absorption of ultraviolet (UV) light in silicon beside having larger beam size and high energy density than other laser light sources (Watanabe, et al. 1994). Another major advantage of the excimer lasers is it low-temperature polysilicon annealing. Excimer laser with 308 nm wavelength for example has been reported can transform 50-nm-thin layers of amorphous silicon into high-quality polycrystalline silicon with greatly enhanced electron mobility, for use in flat-panel displays for mobile phones and flat-screen televisions (Delmdahl, 2010). In the low-temperature annealing of polysilicon, excimer lasers with UV output energies of over 1 J per pulse and output powers of 600 W are used to manufacture liquid-crystal and organic LED backplanes at a rate of 100 cm2 s–1. A new VYPER/LB750 line beam annealing system enables volume production of low-temperature polysilicon (LTPS) on large generation 6 glass panels. LTPS is the key material for high-resolution liquid crystal displays (LCDs) and organic lightemitting diode (OLED) displays for smartphones, tablet PCs and TVs.